CASE STUDIES

Ceramic 3D power modules are used in electromotor drivers, which need high currents and ...
Low-Temperature Co-fired Ceramic (LTCC) technology (i.e. a combination of ceramic and thick-film technology) is suitable for the fabrication ...
LTCC-based ceramic packaging of integrated circuits and MEMS is one segment of the entire packaging market ...
Ceramic microsystems are mostly used where chemical, mechanical, and high-temperature stability are needed.

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