As the result of cooperation between partners in ASAM project (LMFE and KEKO Equipment) the article was published in Materials journal. It describes the study of alloy for metallization for LTCC ceramics, highlights the problems with soldering and bonding, and provides some guidelines and material solutions for usage in similar applications. It is mainly concentrated on search of a compromise between the usage of low-temperature ceramics with mostly silver metallization, which is more affordable than the established use of gold, and the usage of aluminum wire bonds for all necessary connections – power and signals. The selected structure, materials and methods of work presented in the paper were proved to be correct, which was also confirmed by an electrical test.
Link to the article: https://www.mdpi.com/1996-1944/15/3/1036