LTCC-based ceramic packaging of integrated circuits and MEMS is one segment of the entire packaging market mostly used where mechanical and high-temperature stability, chemical inertness and hermetical structure are needed. Low-Temperature Co-fired Ceramic (LTCC) technology is also suitable for System-in-Package (SiP) type of assembly.
We will use your data solely for the purpose for which we obtained your consent. We will use your personal data confidentially and will not pass it on to third parties. We treat your privacy in accordance with the provisions of the GDPR and the Personal Data Protection Act.
You can unsubscribe from receiving messages at any time by sending a message to info@asam-projet.eu with the subject “Unsubscribe.” After processing the cancellation request, Center of Excellence, Institute for Research and Development of Advanced Non-Metallic Materials with Technologies of the Future will stop sending content from which you have unsubscribed. For details on unsubscribing, data processing, and personal data protection, see Data Protection.
