Keramična ohišja

Ohišenje (ang. packaging) predstavlja pomemben del elektronskih komponent. Še večjo pomembnost pa ima ohišenje pri MEMS in drugih mikrosistemih, kjer mora ohišje zagotoviti zaščito in varno delovanje ter povezljivost električnih, mehanskih, kemijskih, fluidnih, toplotnih in drugih funkcij. V nekaterih primerih so ohišenja zelo kompleksna, vsebujejo več komponent in tudi sama integrirajo nekatere funkcije (ang. System in Package – SiP). Med različne tehnologije ohišenja spadajo tudi keramične tehnologije. Pri tem je keramika z nizko temperaturo žganja (ang. Low Temperature Co-fired Ceramics – LTCC) primerna za SiP in zahtevnejšo uporabo.

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